Micro Pin Grid Array Sockets: 3D 模型 - SOLIDWORKS, Inventor, CATIA V5, AutoCAD, STEP, STL 以及更多 | TraceParts

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- PGA/BGA/PLCC Sockets
  - Micro Pin Grid Array Sockets

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内容类型
- 带 CAD 模型 (90)
Omniclass number
- 23.35.27.13 (90)

3D 模型可用于

AutoCAD
SOLIDWORKS
Inventor
Revit
SketchUp
CATIA
Pro/ENGINEER
Creo
Solid Edge
DesignSpark
Alibre Design
BricsCAD
Fusion
SpaceClaim
TopSolid
ZW3D
GstarCAD
EAGLE
KiCAD
Altium Designer
ZUKEN CR-8000
STL
STEP
DWG
DXF
IGES
PDF
以及更多

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Interconnect components

3 结果

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μPGA 1.27 mm grid, interconnect sockets with through hole solder tail and connecting pin Ø 0.31 mm.

μPGA 1.27 mm grid, interconnect sockets with through hole solder tail and connecting pin Ø 0.31 mm.

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μPGA sockets 1.27 mm grid with through hole solder tails length 2.79 mm.

μPGA sockets 1.27 mm grid with through hole solder tails length 2.79 mm.

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μPGA sockets 1.27 mm grid, surface mount.

μPGA sockets 1.27 mm grid, surface mount.

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