Ball Grid Array Sockets: 3D 模型 - SOLIDWORKS, Inventor, CATIA V5, AutoCAD, STEP, STL 以及更多 | TraceParts

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- PGA/BGA/PLCC Sockets
  - Ball Grid Array Sockets

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内容类型
- 带 CAD 模型 (180)
Omniclass number
- 23.35.27.13 (180)

3D 模型可用于

AutoCAD
SOLIDWORKS
Inventor
Revit
SketchUp
CATIA
Pro/ENGINEER
Creo
Solid Edge
DesignSpark
Alibre Design
BricsCAD
Fusion
SpaceClaim
TopSolid
ZW3D
GstarCAD
EAGLE
KiCAD
Altium Designer
ZUKEN CR-8000
STL
STEP
DWG
DXF
IGES
PDF
以及更多

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Interconnect components

4 结果

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BGA adapter 1.27 mm grid pluggable into the corresponding socket.

BGA adapter 1.27 mm grid pluggable into the corresponding socket.

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BGA interconnect sockets 1.27 mm grid, through hole solder tails and connecting pin Ø 0.40 mm.

BGA interconnect sockets 1.27 mm grid, through hole solder tails and connecting pin Ø 0.40 mm.

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BGA interconnect sockets 1.27 mm grid, with surface mount terminations and connecting pin Ø 0.41 mm.

BGA interconnect sockets 1.27 mm grid, with surface mount terminations and connecting pin Ø 0.41 mm.

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BGA sockets 1.27 mm grid with self-aligning surface mount floating contacts.

BGA sockets 1.27 mm grid with self-aligning surface mount floating contacts.

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