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By Samtec

LPAM - .050" LP Array™ High-Speed High-Density Low Profile Open-Pin-Field Array, Terminal

Manufacturer Samtec
Description .050'' LP Array™ High-Speed High-Density Low Profile Open-Pin-Field Array, Terminal, LPAM-10-01.0-L-04-1-K-TR
Part number LPAM-10-01.0-L-04-1-K-TR
Series LPAM
Number of positions 10
Lead style -01.0: 1.0mm
CAD models
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Product selection

Series
LPAM
No of pos. per row
Lead style
Plating specification
Row specification
Solder type
Pick & place pad
-K: Polyimide film pad
Packaging

Product Description

  • Low profile 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 400 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • 56 Gbps PAM4 performance

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Samtec

Samtec

Samtec is the service leader in the electronic interconnect industry and a global manufacturer of Connectors, Cables, Optics and RF Systems

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