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Fischer Elektronik GmbH & Co. KG

ICK BGA 25 x 25 x 14, for IC design BGA and others, 25 x 25 x 14 mm (B x L x H)

Heatsinks for BGA

Manufacturer Fischer Elektronik GmbH & Co. KG
Description Heatsinks for BGA
Reference ICK BGA 25 x 25 x 14
Sélection de produit
Selector Reference Desingation way of fixation socket suitable for processor type thermal resistance_K/W dissipation loss P_W surface
1 ICK BGA 25 x 25 x 14 Heatsink for IC design BGA and others, 25 x 25 x 14 mm (B x L x H) therm. conductive foil, therm. cond. adhesive universal universal 17 - 7,5 3,5 black anodised
Reference
Desingation
way of fixation
socket
suitable for processor type
thermal resistance_K/W
dissipation loss P_W
surface
Documentations
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Fischer Elektronik GmbH & Co. KG
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