WÜRTH ELEKTRONIK - ELECTROMECHANICAL COMPONENTS - BTB-Board To Board - Socket Header - 2.00 mm - 2 Row

Manufacturer WÜRTH ELEKTRONIK
Description ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm)
Part Number 62130421821
Insulator Material LCP
Insulator Colour Black
Contact Material Copper Alloy
Contact Plating Gold
Contact Type Stamped
Standard Polarities 04;06;08;10;14;16;20;24
Pitch 2.00 (mm)
Quality Class 3 as per CECC 75 301-802
Operating Temperature -40 °C up to +125 °C
Insulator Flammability Rating UL94-V0
Rated Current UL (A) 2
Working Voltage UL (VAC) 250
Withstanding Voltage UL (KVAC/min) 0.5
Contact Resistance UL (mOHM) 20
Insulation Resistance >1000 (MΩ)
UL E323964
Compliance Lead free / RoHS
Solder Profile JEDEC lead free reflow soldering process
Packaging Tape and Reel with Cap
Orientation Straight
Gender Female
Product selection
Selector Part Number Description Insulator Material Insulator Colour Contact Material Contact Plating Contact Type Standard Polarities Pitch Quality Class Operating Temperature Insulator Flammability Rating Rated Current UL (A) Working Voltage UL (VAC) Withstanding Voltage UL (KVAC/min) Contact Resistance UL (mOHM) Insulation Resistance UL Compliance Solder Profile Packaging
1 62130421821 ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm) LCP Black Copper Alloy Gold Stamped 04;06;08;10;14;16;20;24 2.00 (mm) 3 as per CECC 75 301-802 -40 °C up to +125 °C UL94-V0 2 250 0.5 20 >1000 (MΩ) E323964 Lead free / RoHS JEDEC lead free reflow soldering process Tape and Reel with Cap
2 62130621821 ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm) LCP Black Copper Alloy Gold Stamped 04;06;08;10;14;16;20;24 2.00 (mm) 3 as per CECC 75 301-802 -40 °C up to +125 °C UL94-V0 2 250 0.5 20 >1000 (MΩ) E323964 Lead free / RoHS JEDEC lead free reflow soldering process Tape and Reel with Cap
3 62130821821 ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm) LCP Black Copper Alloy Gold Stamped 04;06;08;10;14;16;20;24 2.00 (mm) 3 as per CECC 75 301-802 -40 °C up to +125 °C UL94-V0 2 250 0.5 20 >1000 (MΩ) E323964 Lead free / RoHS JEDEC lead free reflow soldering process Tape and Reel with Cap
4 62131021821 ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm) LCP Black Copper Alloy Gold Stamped 04;06;08;10;14;16;20;24 2.00 (mm) 3 as per CECC 75 301-802 -40 °C up to +125 °C UL94-V0 2 250 0.5 20 >1000 (MΩ) E323964 Lead free / RoHS JEDEC lead free reflow soldering process Tape and Reel with Cap
5 62131421821 ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm) LCP Black Copper Alloy Gold Stamped 04;06;08;10;14;16;20;24 2.00 (mm) 3 as per CECC 75 301-802 -40 °C up to +125 °C UL94-V0 2 250 0.5 20 >1000 (MΩ) E323964 Lead free / RoHS JEDEC lead free reflow soldering process Tape and Reel with Cap
6 62131621821 ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm) LCP Black Copper Alloy Gold Stamped 04;06;08;10;14;16;20;24 2.00 (mm) 3 as per CECC 75 301-802 -40 °C up to +125 °C UL94-V0 2 250 0.5 20 >1000 (MΩ) E323964 Lead free / RoHS JEDEC lead free reflow soldering process Tape and Reel with Cap
7 62132021821 ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm) LCP Black Copper Alloy Gold Stamped 04;06;08;10;14;16;20;24 2.00 (mm) 3 as per CECC 75 301-802 -40 °C up to +125 °C UL94-V0 2 250 0.5 20 >1000 (MΩ) E323964 Lead free / RoHS JEDEC lead free reflow soldering process Tape and Reel with Cap
8 62132421821 ConPSHD Dual SMT Socket Header Low Profile Bottom Entry _2,00 (mm) LCP Black Copper Alloy Gold Stamped 04;06;08;10;14;16;20;24 2.00 (mm) 3 as per CECC 75 301-802 -40 °C up to +125 °C UL94-V0 2 250 0.5 20 >1000 (MΩ) E323964 Lead free / RoHS JEDEC lead free reflow soldering process Tape and Reel with Cap
Part Number
Description
Insulator Material
Insulator Colour
Contact Material
Contact Plating
Contact Type
Standard Polarities
Pitch
Quality Class
Operating Temperature
Insulator Flammability Rating
Rated Current UL (A)
Working Voltage UL (VAC)
Withstanding Voltage UL (KVAC/min)
Contact Resistance UL (mOHM)
Insulation Resistance
UL
Compliance
Solder Profile
Packaging
Documentation
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