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QSFP/QSFP+/zQSFP+

Manufacturer TE Connectivity
Description zQSFP+ STACKED RECEPTACLE ASSEMBLY 2X1
Part Number 2227669-2
URL http://www.te.com/usa-en/product-2227669-2.html?te_bu=Cor&te_type=other&te_campaign=trp_glo_buylink-pdp&elqCampaignId=29714
Series zQSFP+/QSFP28
Contact Mating Area Plating Thickness [µm] .76
Contact Mating Area Plating Thickness [µin] 30
PCB Thickness (Recommended) [mm] 1.57
PCB Thickness (Recommended) [in] .062
Tail Length [mm] 2
Tail Length [in] .079
Operating Temperature Range [°C] -40 – 85
Operating Temperature Range [°F] -40 – 185
Centerline (Pitch) [mm] .8
Centerline (Pitch) [in] .0315
Contact Current Rating (Max) [A] .5
Data Rate (Max) [Gb/s] 25
Product Type Cage Assembly with Integrated Connector
Form Factor zQSFP+
Number of Ports 2
Contact Mating Area Plating Material Gold
Packaging Method Box & Tray
UL Flammability Rating UL 94V-0
Connector & Contact Terminates To Printed Circuit Board
Connector Mounting Type Board Mount
Circuit Application Signal
Connector System Cable-to-Board
Number of Positions 76
Sealable No
Enhancements Standard
Termination Method to Printed Circuit Board Through Hole - Press-Fit
PCB Contact Termination Area Plating Material Gold
Rear EONs per Port Column 3
Heat Sink Compatible No
Included Heat Sink No
Included Lightpipe Yes
Lightpipe Configuration Outer Left Indicator Up
Contact Underplating Material Tin
Port Matrix Configuration 2 x 1
EMI Containment Feature Type Internal/External EMI Springs
Cage Material Nickel Silver
Cage Type Stacked
For Use With Pluggable I/O Products QSFP Cable Assembly
Pluggable I/O Applications Standard
Product selection
Selector Part Number Description Buy Now Series Contact Mating Area Plating Thickness [µm] Contact Mating Area Plating Thickness [µin] PCB Thickness (Recommended) [mm] PCB Thickness (Recommended) [in] Tail Length [mm] Tail Length [in] Operating Temperature Range [°C] Operating Temperature Range [°F] Centerline (Pitch) [mm] Centerline (Pitch) [in] Contact Current Rating (Max) [A] Data Rate (Max) [Gb/s] Product Type Form Factor Number of Ports Contact Mating Area Plating Material Packaging Method UL Flammability Rating Connector & Contact Terminates To Connector Mounting Type Circuit Application Connector System Number of Positions Sealable Enhancements Termination Method to Printed Circuit Board PCB Contact Termination Area Plating Material Rear EONs per Port Column Heat Sink Compatible Included Heat Sink Included Lightpipe Lightpipe Configuration Contact Underplating Material Port Matrix Configuration EMI Containment Feature Type Cage Material Cage Type For Use With Pluggable I/O Products Pluggable I/O Applications
1 2227669-2 zQSFP+ STACKED RECEPTACLE ASSEMBLY 2X1 Buy Now zQSFP+/QSFP28 .76 30 1.57 .062 2 .079 -40 – 85 -40 – 185 .8 .0315 .5 25 Cage Assembly with Integrated Connector zQSFP+ 2 Gold Box & Tray UL 94V-0 Printed Circuit Board Board Mount Signal Cable-to-Board 76 No Standard Through Hole - Press-Fit Gold 3 No No Yes Outer Left Indicator Up Tin 2 x 1 Internal/External EMI Springs Nickel Silver Stacked QSFP Cable Assembly Standard
Part Number
Description
Buy Now
Series
Contact Mating Area Plating Thickness [µm]
Contact Mating Area Plating Thickness [µin]
PCB Thickness (Recommended) [mm]
PCB Thickness (Recommended) [in]
Tail Length [mm]
Tail Length [in]
Operating Temperature Range [°C]
Operating Temperature Range [°F]
Centerline (Pitch) [mm]
Centerline (Pitch) [in]
Contact Current Rating (Max) [A]
Data Rate (Max) [Gb/s]
Product Type
Form Factor
Number of Ports
Contact Mating Area Plating Material
Packaging Method
UL Flammability Rating
Connector & Contact Terminates To
Connector Mounting Type
Circuit Application
Connector System
Number of Positions
Sealable
Enhancements
Termination Method to Printed Circuit Board
PCB Contact Termination Area Plating Material
Rear EONs per Port Column
Heat Sink Compatible
Included Heat Sink
Included Lightpipe
Lightpipe Configuration
Contact Underplating Material
Port Matrix Configuration
EMI Containment Feature Type
Cage Material
Cage Type
For Use With Pluggable I/O Products
Pluggable I/O Applications
Documentation