SO DIMM Sockets

Manufacturer TE Connectivity
Description SEMI-HARD TRAY DDR3 204P 5.2H STD Au0.76
Part Number 2013289-3
URL http://www.te.com/usa-en/product-2013289-3.html?te_bu=Cor&te_type=other&te_campaign=trp_glo_buylink-pdp&elqCampaignId=29714
Series STA,STA.20
Stack Height [mm] 5.2
Stack Height [in] .205
Row-to-Row Spacing [mm] 8.2
Row-to-Row Spacing [in] .322
Contact Mating Area Plating Thickness [µm] .76
Contact Mating Area Plating Thickness [µin] 30
Operating Temperature Range [°C] -55 – 85
Operating Temperature Range [°F] -67 – 185
Centerline (Pitch) [mm] .6
Centerline (Pitch) [in] .024
Contact Current Rating (Max) [A] .5
SGRAM Voltage [V] 1.5
DRAM Voltage [V] 1.5
Profile Standard
Number of Rows 2
Contact Mating Area Plating Material Gold
Packaging Method Semi-Hard Tray Assembly
Comment With floating peg.
Housing Color Black
Housing Material High Temperature Thermoplastic
Keying Standard
??????? 120
Product Type Socket
Socket Type Memory Card
UL Flammability Rating UL 94V-0
Connector & Contact Terminates To Printed Circuit Board
Connector Mounting Type Board Mount
Circuit Application Power
Connector System Cable-to-Board
Number of Positions 204
Sealable No
Contact Base Material Copper Alloy
PCB Mount Retention Type Solder Peg
PCB Mount Retention With
PCB Contact Termination Area Plating Material Gold
Insertion Style Cam-In
Latch Material Stainless Steel
Latch Plating Material Tin
Module Key Type SGRAM
Module Orientation Right Angle
PCB Mounting Style Surface Mount
Socket Style SO DIMM
Number of Bays 2
Number of Keys 1
DRAM Type Double Data Rate (DDR) 3
Ejector Location Both Ends
Ejector Type Locking
Center Key Offset Left
Product selection
Selector Part Number Description Buy Now Series Stack Height [mm] Stack Height [in] Row-to-Row Spacing [mm] Row-to-Row Spacing [in] Contact Mating Area Plating Thickness [µm] Contact Mating Area Plating Thickness [µin] Operating Temperature Range [°C] Operating Temperature Range [°F] Centerline (Pitch) [mm] Centerline (Pitch) [in] Contact Current Rating (Max) [A] SGRAM Voltage [V] DRAM Voltage [V] Profile Number of Rows Contact Mating Area Plating Material Packaging Method Comment Housing Color Housing Material Keying ??????? Product Type Socket Type UL Flammability Rating Connector & Contact Terminates To Connector Mounting Type Circuit Application Connector System Number of Positions Sealable Contact Base Material PCB Mount Retention Type PCB Mount Retention PCB Contact Termination Area Plating Material Insertion Style Latch Material Latch Plating Material Module Key Type Module Orientation PCB Mounting Style Socket Style Number of Bays Number of Keys DRAM Type Ejector Location Ejector Type Center Key
1 2013289-3 SEMI-HARD TRAY DDR3 204P 5.2H STD Au0.76 Buy Now STA,STA.20 5.2 .205 8.2 .322 .76 30 -55 – 85 -67 – 185 .6 .024 .5 1.5 1.5 Standard 2 Gold Semi-Hard Tray Assembly With floating peg. Black High Temperature Thermoplastic Standard 120 Socket Memory Card UL 94V-0 Printed Circuit Board Board Mount Power Cable-to-Board 204 No Copper Alloy Solder Peg With Gold Cam-In Stainless Steel Tin SGRAM Right Angle Surface Mount SO DIMM 2 1 Double Data Rate (DDR) 3 Both Ends Locking Offset Left
7 2013290-2 SEMI-HARD TRAY DDR3 204P 5.2H RVS Au0.25 Buy Now Raychem RVS 5.2 .205 8.2 .322 .254 10 -55 – 85 -67 – 185 .6 .024 .5 1.5 1.5 Reverse 2 Gold Semi-Hard Tray Assembly With floating peg. Black High Temperature Thermoplastic Reverse 20 Socket Memory Card UL 94V-0 Printed Circuit Board Board Mount Power Cable-to-Board 204 No Copper Alloy Solder Peg With Gold Cam-In Stainless Steel Tin SGRAM Right Angle Surface Mount SO DIMM 2 1 Double Data Rate (DDR) 3 Both Ends Locking Offset Right
8 2013297-1 SEMI-HARD TRAY DDR3 204P 8H ST Buy Now 8 .315 8.2 .322 -55 – 85 -67 – 185 .6 .024 .5 1.5 1.5 Standard 2 Gold Flash Semi-Hard Tray Assembly With floating peg. Black High Temperature Thermoplastic Standard 20 Socket Memory Card UL 94V-0 Printed Circuit Board Board Mount Power Cable-to-Board 204 No Copper Alloy Solder Peg With Gold Cam-In Stainless Steel Tin SGRAM Right Angle Surface Mount SO DIMM 2 1 Double Data Rate (DDR) 3 Both Ends Locking Offset Left
9 2013310-3 SEMI-HARD TRAY DDR3 204P 9.2H STD Au0.76 Buy Now STA,STA.20 9.2 .362 8.2 .322 .76 30 -55 – 85 -67 – 185 .6 .024 .5 1.5 1.5 Standard 2 Gold Semi-Hard Tray Assembly With floating peg. Black High Temperature Thermoplastic Standard 20 Socket Memory Card UL 94V-0 Printed Circuit Board Board Mount Power Cable-to-Board 204 No Copper Alloy Solder Peg With Gold Cam-In Stainless Steel Tin SGRAM Right Angle Surface Mount SO DIMM 2 1 Double Data Rate (DDR) 3 Both Ends Locking Offset Left
10 2013311-3 SEMI-HARD TRAY DDR3 204P 9.2H RVS Au0.76 Buy Now Raychem RVS 9.2 .362 8.2 .322 .76 30 -55 – 85 -67 – 185 .6 .024 .5 1.5 1.5 Reverse 2 Gold Semi-Hard Tray Assembly With floating peg. Black High Temperature Thermoplastic Reverse 20 Socket Memory Card UL 94V-0 Printed Circuit Board Board Mount Power Cable-to-Board 204 No Copper Alloy Solder Peg With Gold Cam-In Stainless Steel Tin SGRAM Right Angle Surface Mount SO DIMM 2 1 Double Data Rate (DDR) 3 Both Ends Locking Offset Right
11 2-2013022-2 EMBOSS TAPE DDR3 204P 4H STD A Buy Now STA,STA.20 4 .157 8.2 .322 .254 10 -55 – 85 -67 – 185 .6 .024 .5 1.5 1.5 Standard 2 Gold Emboss on Reel Without floating peg. Black High Temperature Thermoplastic Standard 200 Socket Memory Card UL 94V-0 Printed Circuit Board Board Mount Power Cable-to-Board 204 No Copper Alloy Solder Tail (Pin) With Gold Flash Cam-In Stainless Steel Tin SGRAM Right Angle Surface Mount SO DIMM 2 1 Double Data Rate (DDR) 3 Both Ends Locking Offset Left
12 2-2013022-3 EMBOSS TAPE DDR3 204P 4H STD Au 0.76 Buy Now STA,STA.20 4 .157 8.2 .322 .76 30 -55 – 85 -67 – 185 .6 .024 .5 1.5 1.5 Standard 2 Gold Emboss on Reel Without floating peg. Black High Temperature Thermoplastic Standard 200 Socket Memory Card UL 94V-0 Printed Circuit Board Board Mount Power Cable-to-Board 204 No Copper Alloy Solder Tail (Pin) With Gold Flash Cam-In Stainless Steel Tin SGRAM Right Angle Surface Mount SO DIMM 2 1 Double Data Rate (DDR) 3 Both Ends Locking Offset Left
13 2-2013287-2 EMBOSS TAPE DDR3 204P 4H RVS Au 0.25 Buy Now Raychem RVS 4 .157 8.2 .322 .254 10 -55 – 85 -67 – 185 .6 .024 .5 1.5 1.5 Reverse 2 Gold Emboss on Reel Without floating peg. Black High Temperature Thermoplastic Reverse 200 Socket Memory Card UL 94V-0 Printed Circuit Board Board Mount Power Cable-to-Board 204 No Copper Alloy Solder Tail (Pin) With Gold Cam-In Stainless Steel Tin SGRAM Right Angle Surface Mount SO DIMM 2 1 Double Data Rate (DDR) 3 Both Ends Locking Offset Right
14 2-2013290-3 EMBOSS TAPE DDR3 204P 5.2H RVS Au 0.76 Buy Now Raychem RVS 5.2 .205 8.2 .322 .76 30 -55 – 85 -67 – 185 .6 .024 .5 1.5 1.5 Reverse 2 Gold Emboss on Reel With floating peg. Black High Temperature Thermoplastic Reverse 200 Socket Memory Card UL 94V-0 Printed Circuit Board Board Mount Power Cable-to-Board 204 No Copper Alloy Solder Peg With Gold Cam-In Stainless Steel Tin SGRAM Right Angle Surface Mount SO DIMM 2 1 Double Data Rate (DDR) 3 Both Ends Locking Offset Right
2 2-2013297-1 EMBOSS TAPE DDR3 204P 8H STD Buy Now STA,STA.20 8 .315 8.2 .322 -55 – 85 -67 – 185 .6 .024 .5 1.5 1.5 Standard 2 Gold Flash Emboss on Reel With floating peg. Black High Temperature Thermoplastic Standard 150 Socket Memory Card UL 94V-0 Printed Circuit Board Board Mount Power Cable-to-Board 204 No Copper Alloy Solder Peg With Gold Cam-In Stainless Steel Tin SGRAM Right Angle Surface Mount SO DIMM 2 1 Double Data Rate (DDR) 3 Both Ends Locking Offset Left
3 2-2013298-1 EMBOSS TAPE DDR3 204P 8H RVS Buy Now Raychem RVS 8 .315 8.2 .322 -55 – 85 -67 – 185 .6 .024 .5 1.5 1.5 Reverse 2 Gold Flash Emboss on Reel With floating peg. Black High Temperature Thermoplastic Reverse 150 Socket Memory Card UL 94V-0 Printed Circuit Board Board Mount Power Cable-to-Board 204 No Copper Alloy Solder Peg With Gold Cam-In Stainless Steel Tin SGRAM Right Angle Surface Mount SO DIMM 2 1 Double Data Rate (DDR) 3 Both Ends Locking Offset Right
4 2-2013298-3 EMBOSS TAPE DDR3 204P 8H RVS Au 0.76 Buy Now Raychem RVS 8 .315 8.2 .322 .76 30 -55 – 85 -67 – 185 .6 .024 .5 1.5 1.5 Reverse 2 Gold Emboss on Reel With floating peg. Black High Temperature Thermoplastic Reverse 150 Socket Memory Card UL 94V-0 Printed Circuit Board Board Mount Power Cable-to-Board 204 No Copper Alloy Solder Peg With Gold Cam-In Stainless Steel Tin SGRAM Right Angle Surface Mount SO DIMM 2 1 Double Data Rate (DDR) 3 Both Ends Locking Offset Right
5 2-2013311-2 EMBOSS TAPE DDR3 204P 9.2H RVS Buy Now Raychem RVS 9.2 .362 8.2 .322 .254 10 -55 – 85 -67 – 185 .6 .024 .5 1.5 1.5 Reverse 2 Gold Emboss on Reel With floating peg. Black High Temperature Thermoplastic Reverse 150 Socket Memory Card UL 94V-0 Printed Circuit Board Board Mount Power Cable-to-Board 204 No Copper Alloy Solder Peg With Gold Cam-In Stainless Steel Tin SGRAM Right Angle Surface Mount SO DIMM 2 1 Double Data Rate (DDR) 3 Both Ends Locking Offset Right
6 2-2013311-3 EMBOSS TAPE DDR3 204P 9.2H RVS Au 0.76 Buy Now Raychem RVS 9.2 .362 8.2 .322 .76 30 -55 – 85 -67 – 185 .6 .024 .5 1.5 1.5 Reverse 2 Gold Emboss on Reel With floating peg. Black High Temperature Thermoplastic Reverse 150 Socket Memory Card UL 94V-0 Printed Circuit Board Board Mount Power Cable-to-Board 204 No Copper Alloy Solder Peg With Gold Cam-In Stainless Steel Tin SGRAM Right Angle Surface Mount SO DIMM 2 1 Double Data Rate (DDR) 3 Both Ends Locking Offset Right
Part Number
Description
Buy Now
Series
Stack Height [mm]
Stack Height [in]
Row-to-Row Spacing [mm]
Row-to-Row Spacing [in]
Contact Mating Area Plating Thickness [µm]
Contact Mating Area Plating Thickness [µin]
Operating Temperature Range [°C]
Operating Temperature Range [°F]
Centerline (Pitch) [mm]
Centerline (Pitch) [in]
Contact Current Rating (Max) [A]
SGRAM Voltage [V]
DRAM Voltage [V]
Profile
Number of Rows
Contact Mating Area Plating Material
Packaging Method
Comment
Housing Color
Housing Material
Keying
???????
Product Type
Socket Type
UL Flammability Rating
Connector & Contact Terminates To
Connector Mounting Type
Circuit Application
Connector System
Number of Positions
Sealable
Contact Base Material
PCB Mount Retention Type
PCB Mount Retention
PCB Contact Termination Area Plating Material
Insertion Style
Latch Material
Latch Plating Material
Module Key Type
Module Orientation
PCB Mounting Style
Socket Style
Number of Bays
Number of Keys
DRAM Type
Ejector Location
Ejector Type
Center Key
Documentation
DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 4mm HEIGHT STANDARD TYPE - 2013022-1
DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 4mm HEIGHT STANDARD TYPE - 2-2013022-1
DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 4mm HEIGHT STANDARD TYPE - 2-2013022-2
DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 4mm HEIGHT STANDARD TYPE - 2-2013022-3
DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 4mm HEIGHT REVERSE TYPE - 2-2013287-1
DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 4mm HEIGHT REVERSE TYPE - 2-2013287-2
DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 5.2mm HEIGHT STANDARD TYPE - 2013289-1
DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 5.2mm HEIGHT STANDARD TYPE - 2013289-2
DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 5.2mm HEIGHT STANDARD TYPE - 2013289-3
DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 5.2mm HEIGHT STANDARD TYPE - 2-2013289-1
DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 5.2mm HEIGHT STANDARD TYPE - 2-2013289-2
DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 5.2mm HEIGHT STANDARD TYPE - 2-2013289-3
DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 5.2mm HEIGHT REVERSE TYPE - 2013290-1
DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 5.2mm HEIGHT REVERSE TYPE - 2013290-2
DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 5.2mm HEIGHT REVERSE TYPE - 2-2013290-1
DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 5.2mm HEIGHT REVERSE TYPE - 2-2013290-2
DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 5.2mm HEIGHT REVERSE TYPE - 2-2013290-3
DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 8.0mm HEIGHT STANDARD TYPE - 2013297-1
DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 8.0mm HEIGHT STANDARD TYPE - 2-2013297-1
DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 8.0mm HEIGHT STANDARD TYPE - 2-2013297-3
DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 8.0mm HEIGHT REVERSE TYPE - 2-2013298-1
DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 8.0mm HEIGHT REVERSE TYPE - 2-2013298-3
DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 9.2mm HEIGHT STANDARD TYPE - 2013310-1
DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 9.2mm HEIGHT STANDARD TYPE - 2013310-3
DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 9.2mm HEIGHT STANDARD TYPE - 2-2013310-1
DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 9.2mm HEIGHT STANDARD TYPE - 2-2013310-2
DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 9.2mm HEIGHT REVERSE TYPE - 2013311-3
DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 9.2mm HEIGHT REVERSE TYPE - 2-2013311-1
DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 9.2mm HEIGHT REVERSE TYPE - 2-2013311-2
DDR3 SODIMM SOCKET 0.6mm PITCH 204POS 9.2mm HEIGHT REVERSE TYPE - 2-2013311-3
DDR3 DIMM Sockets Flyer 6-1773454-7 05/09 - 2013022-1
DDR3 DIMM Sockets Flyer 6-1773454-7 05/09 - 2013289-1
DDR3 DIMM Sockets Flyer 6-1773454-7 05/09 - 2013289-2
DDR3 DIMM Sockets Flyer 6-1773454-7 05/09 - 2013289-3
DDR3 DIMM Sockets Flyer 6-1773454-7 05/09 - 2013290-1
DDR3 DIMM Sockets Flyer 6-1773454-7 05/09 - 2013290-2
DDR3 DIMM Sockets Flyer 6-1773454-7 05/09 - 2-2013022-1
DDR3 DIMM Sockets Flyer 6-1773454-7 05/09 - 2-2013022-2
DDR3 DIMM Sockets Flyer 6-1773454-7 05/09 - 2-2013022-3
DDR3 DIMM Sockets Flyer 6-1773454-7 05/09 - 2-2013287-1
DDR3 DIMM Sockets Flyer 6-1773454-7 05/09 - 2-2013287-2
DDR3 DIMM Sockets Flyer 6-1773454-7 05/09 - 2-2013289-1
DDR3 DIMM Sockets Flyer 6-1773454-7 05/09 - 2-2013289-2
DDR3 DIMM Sockets Flyer 6-1773454-7 05/09 - 2-2013289-3
DDR3 DIMM Sockets Flyer 6-1773454-7 05/09 - 2-2013290-1
DDR3 DIMM Sockets Flyer 6-1773454-7 05/09 - 2-2013290-2
DDR3 DIMM Sockets Flyer 6-1773454-7 05/09 - 2-2013290-3
6-1773457-3_DDR3_DIMM_SOCKETS - 2013022-1
6-1773457-3_DDR3_DIMM_SOCKETS - 2013289-1
6-1773457-3_DDR3_DIMM_SOCKETS - 2013289-2
6-1773457-3_DDR3_DIMM_SOCKETS - 2013289-3
6-1773457-3_DDR3_DIMM_SOCKETS - 2013297-1
6-1773457-3_DDR3_DIMM_SOCKETS - 2013310-1
6-1773457-3_DDR3_DIMM_SOCKETS - 2013310-3
6-1773457-3_DDR3_DIMM_SOCKETS - 2-2013022-1
6-1773457-3_DDR3_DIMM_SOCKETS - 2-2013022-2
6-1773457-3_DDR3_DIMM_SOCKETS - 2-2013022-3
6-1773457-3_DDR3_DIMM_SOCKETS - 2-2013289-1
6-1773457-3_DDR3_DIMM_SOCKETS - 2-2013289-2
6-1773457-3_DDR3_DIMM_SOCKETS - 2-2013289-3
6-1773457-3_DDR3_DIMM_SOCKETS - 2-2013297-1
6-1773457-3_DDR3_DIMM_SOCKETS - 2-2013297-3
6-1773457-3_DDR3_DIMM_SOCKETS - 2-2013310-1
6-1773457-3_DDR3_DIMM_SOCKETS - 2-2013310-2
3D PDF - 2013022-1
3D PDF - 2013289-1
3D PDF - 2013289-2
3D PDF - 2013289-3
3D PDF - 2013290-1
3D PDF - 2013290-2
3D PDF - 2013297-1
3D PDF - 2013310-1
3D PDF - 2013310-3
3D PDF - 2013311-3
3D PDF - 2-2013022-1
3D PDF - 2-2013022-2
3D PDF - 2-2013022-3
3D PDF - 2-2013287-1
3D PDF - 2-2013287-2
3D PDF - 2-2013289-1
3D PDF - 2-2013289-2
3D PDF - 2-2013289-3
3D PDF - 2-2013290-1
3D PDF - 2-2013290-2
3D PDF - 2-2013290-3
3D PDF - 2-2013297-1
3D PDF - 2-2013297-3
3D PDF - 2-2013298-1
3D PDF - 2-2013298-3
3D PDF - 2-2013310-1
3D PDF - 2-2013310-2
3D PDF - 2-2013311-1
3D PDF - 2-2013311-2
3D PDF - 2-2013311-3
MD_2013022-1_072420181411_dmtec - 2013022-1
MD_2013289-1_12282017842_dmtec - 2013289-1
MD_2013289-2_06062017029_dmtec - 2013289-2
MD_2013289-3_110420141057_dmtec - 2013289-3
MD_2013290-1_0130201823_dmtec - 2013290-1
MD_2013290-2_0130201823_dmtec - 2013290-2
MD_2013297-1_0130201824_dmtec - 2013297-1
MD_2013310-1_0130201824_dmtec - 2013310-1
MD_2013311-3_08182017654_dmtec - 2013311-3
MD_2-2013022-1_052320181442_dmtec - 2-2013022-1
MD_2-2013022-2_0130201820_dmtec - 2-2013022-2
MD_2-2013287-1_052320181443_dmtec - 2-2013287-1
MD_2-2013289-1_05162018543_dmtec - 2-2013289-1
EMBOSS TAPE DDR3 204P 5.2H STD Au 0.25 - 2-2013289-2
MD_2-2013289-3_11062015822_dmtec - 2-2013289-3
MD_2-2013290-1_09202017337_dmtec - 2-2013290-1
MD_2-2013290-3_062020181216_dmtec - 2-2013290-3
MD_2-2013297-1_0130201821_dmtec - 2-2013297-1
MD_2-2013298-3_0130201821_dmtec - 2-2013298-3
MD_2-2013310-1_04152016554_dmtec - 2-2013310-1
MD_2-2013310-2_03212017232_dmtec - 2-2013310-2
MD_2-2013311-2_10292013824_dmtec - 2-2013311-2
MD_2-2013311-3_08212017647_dmtec - 2-2013311-3
Contact the supplier
TE Connectivity High-performing, reliable product solutions that transmit data, power and signal in cars, planes, power grids, appliances, electronics, factories and more.