SO DIMM Sockets

Manufacturer TE Connectivity
Description EMBOSS DDR2 SODIMM 200P 4H RVS
Part Number 292407-4
URL http://www.te.com/usa-en/product-292407-4.html?te_bu=Cor&te_type=other&te_campaign=trp_glo_buylink-pdp&elqCampaignId=29714
Series DDR2 SO DIMM,Raychem RVS
Stack Height [mm] 4
Stack Height [in] .157
Row-to-Row Spacing [mm] 5.8
Row-to-Row Spacing [in] .228
Operating Temperature Range [°C] -55 – 85
Operating Temperature Range [°F] -67 – 185
Centerline (Pitch) [mm] .6
Centerline (Pitch) [in] .024
Contact Current Rating (Max) [A] .5
SGRAM Voltage [V] 1.8
DRAM Voltage [V] 1.8
Profile Standard
Number of Rows 2
Contact Mating Area Plating Material Gold Flash
Packaging Method Reel
Housing Color Black
Housing Material High Temperature Thermoplastic
Keying Reverse
??????? 200
Product Type Socket
Socket Type Memory Card
UL Flammability Rating UL 94V-0
Connector & Contact Terminates To Printed Circuit Board
Connector Mounting Type Board Mount
Circuit Application Power
Connector System Cable-to-Board
Number of Positions 200
Sealable No
Contact Base Material Copper Alloy
PCB Mount Retention Type Solder Peg
PCB Mount Retention With
PCB Contact Termination Area Plating Material Gold Flash
Insertion Style Cam-In
Latch Material Stainless Steel
Latch Plating Material Tin
Module Key Type SGRAM
Module Orientation Right Angle
PCB Mounting Style Surface Mount
Socket Style SO DIMM
Number of Bays 2
Number of Keys 1
DRAM Type Double Data Rate (DDR) 2
Ejector Location Both Ends
Ejector Type Locking
Center Key Offset Right
Product selection
Selector Part Number Description Buy Now Series Stack Height [mm] Stack Height [in] Row-to-Row Spacing [mm] Row-to-Row Spacing [in] Contact Mating Area Plating Thickness [µm] Contact Mating Area Plating Thickness [µin] Operating Temperature Range [°C] Operating Temperature Range [°F] Centerline (Pitch) [mm] Centerline (Pitch) [in] Contact Current Rating (Max) [A] SGRAM Voltage [V] DRAM Voltage [V] Profile Number of Rows Contact Mating Area Plating Material Packaging Method Housing Color Housing Material Keying ??????? Product Type Socket Type UL Flammability Rating Connector & Contact Terminates To Connector Mounting Type Circuit Application Connector System Number of Positions Sealable Contact Base Material PCB Mount Retention Type PCB Mount Retention PCB Contact Termination Area Plating Material Insertion Style Latch Material Latch Plating Material Module Key Type Module Orientation PCB Mounting Style Socket Style Number of Bays Number of Keys DRAM Type Ejector Location Ejector Type Center Key
1 292407-4 EMBOSS DDR2 SODIMM 200P 4H RVS Buy Now DDR2 SO DIMM,Raychem RVS 4 .157 5.8 .228 -55 – 85 -67 – 185 .6 .024 .5 1.8 1.8 Standard 2 Gold Flash Reel Black High Temperature Thermoplastic Reverse 200 Socket Memory Card UL 94V-0 Printed Circuit Board Board Mount Power Cable-to-Board 200 No Copper Alloy Solder Peg With Gold Flash Cam-In Stainless Steel Tin SGRAM Right Angle Surface Mount SO DIMM 2 1 Double Data Rate (DDR) 2 Both Ends Locking Offset Right
2 292407-5 EMBOSS DDR2 SODIMM 200P 4H RVS Buy Now DDR2 SO DIMM,Raychem RVS 4 .157 5.8 .228 .254 10 -55 – 85 -67 – 185 .6 .024 .5 1.8 1.8 Standard 2 Gold Reel Black High Temperature Thermoplastic Reverse 200 Socket Memory Card UL 94V-0 Printed Circuit Board Board Mount Power Cable-to-Board 200 No Copper Alloy Solder Peg With Gold Flash Cam-In Stainless Steel Tin SGRAM Right Angle Surface Mount SO DIMM 2 1 Double Data Rate (DDR) 2 Both Ends Locking Offset Right
Part Number
Description
Buy Now
Series
Stack Height [mm]
Stack Height [in]
Row-to-Row Spacing [mm]
Row-to-Row Spacing [in]
Contact Mating Area Plating Thickness [µm]
Contact Mating Area Plating Thickness [µin]
Operating Temperature Range [°C]
Operating Temperature Range [°F]
Centerline (Pitch) [mm]
Centerline (Pitch) [in]
Contact Current Rating (Max) [A]
SGRAM Voltage [V]
DRAM Voltage [V]
Profile
Number of Rows
Contact Mating Area Plating Material
Packaging Method
Housing Color
Housing Material
Keying
???????
Product Type
Socket Type
UL Flammability Rating
Connector & Contact Terminates To
Connector Mounting Type
Circuit Application
Connector System
Number of Positions
Sealable
Contact Base Material
PCB Mount Retention Type
PCB Mount Retention
PCB Contact Termination Area Plating Material
Insertion Style
Latch Material
Latch Plating Material
Module Key Type
Module Orientation
PCB Mounting Style
Socket Style
Number of Bays
Number of Keys
DRAM Type
Ejector Location
Ejector Type
Center Key
Documentation
Contact the supplier
TE Connectivity High-performing, reliable product solutions that transmit data, power and signal in cars, planes, power grids, appliances, electronics, factories and more.