2

SO DIMM Sockets

Manufacturer TE Connectivity
Description DDR4 SODIMM 260P 9.2H STD
Part Number 2309413-1
URL http://www.te.com/usa-en/product-2309413-1.html?te_bu=Cor&te_type=other&te_campaign=trp_glo_buylink-pdp&elqCampaignId=29714
Series DDR4 DIMM
Stack Height [mm] 9.2
Stack Height [in] .362
Row-to-Row Spacing [mm] 8.2
Row-to-Row Spacing [in] .322
Operating Temperature Range [°C] -55 – 85
Operating Temperature Range [°F] -67 – 185
Centerline (Pitch) [mm] 7.3
Centerline (Pitch) [in] .0197
Contact Current Rating (Max) [A] .5
SGRAM Voltage [V] 1.2
DRAM Voltage [V] 1.2
Profile High
Number of Rows 2
Contact Mating Area Plating Material Gold Flash
Packaging Method Tape & Reel
Housing Color Black
Housing Material High Temperature Thermoplastic
Keying Standard
??????? 500
Product Type Socket
Socket Type Memory Card
UL Flammability Rating UL 94V-0
Connector & Contact Terminates To Printed Circuit Board
Connector Mounting Type Board Mount
Circuit Application Power
Connector System Cable-to-Board
Number of Positions 260
Sealable No
Contact Base Material Copper Alloy
PCB Mount Retention Type Solder Peg
PCB Mount Retention With
PCB Contact Termination Area Plating Material Gold Flash
Insertion Style Cam-In
Latch Material High Temperature Thermoplastic
Module Key Type Offset Left
Module Orientation Right Angle
PCB Mounting Style Surface Mount
Retention Post Location Both Ends
Retention Post Material Stainless Steel
Socket Style SO DIMM
Contact Underplating Material Nickel
Number of Keys 1
DRAM Type Small Outline (SO)
Ejector Location Both Ends
Ejector Type Locking
Center Key Offset Left
Center Post Without
Product selection
Selector Part Number Description Buy Now Series Stack Height [mm] Stack Height [in] Row-to-Row Spacing [mm] Row-to-Row Spacing [in] Contact Mating Area Plating Thickness [µm] Contact Mating Area Plating Thickness [µin] Operating Temperature Range [°C] Operating Temperature Range [°F] Centerline (Pitch) [mm] Centerline (Pitch) [in] Contact Current Rating (Max) [A] SGRAM Voltage [V] DRAM Voltage [V] Profile Number of Rows Contact Mating Area Plating Material Packaging Method Housing Color Housing Material Keying ??????? Product Type Socket Type UL Flammability Rating Connector & Contact Terminates To Connector Mounting Type Circuit Application Connector System Number of Positions Sealable Contact Base Material PCB Mount Retention Type PCB Mount Retention PCB Contact Termination Area Plating Material Insertion Style Latch Material Module Key Type Module Orientation PCB Mounting Style Retention Post Location Retention Post Material Socket Style Contact Underplating Material Number of Keys DRAM Type Ejector Location Ejector Type Center Key Center Post
1 2309413-1 DDR4 SODIMM 260P 9.2H STD Buy Now DDR4 DIMM 9.2 .362 8.2 .322 -55 – 85 -67 – 185 7.3 .0197 .5 1.2 1.2 High 2 Gold Flash Tape & Reel Black High Temperature Thermoplastic Standard 500 Socket Memory Card UL 94V-0 Printed Circuit Board Board Mount Power Cable-to-Board 260 No Copper Alloy Solder Peg With Gold Flash Cam-In High Temperature Thermoplastic Offset Left Right Angle Surface Mount Both Ends Stainless Steel SO DIMM Nickel 1 Small Outline (SO) Both Ends Locking Offset Left Without
2 2309413-2 DDR4 SODIMM 260P 9.2H STD Buy Now DDR4 DIMM 9.2 .362 8.2 .322 .127 5 -55 – 85 -67 – 185 .5 .0197 .5 1.2 1.2 High 2 Gold Tape & Reel Black High Temperature Thermoplastic Standard 500 Socket Memory Card UL 94V-0 Printed Circuit Board Board Mount Power Cable-to-Board 260 No Copper Alloy Solder Peg With Gold Flash Cam-In High Temperature Thermoplastic Offset Left Right Angle Surface Mount Both Ends Stainless Steel SO DIMM Nickel 1 Small Outline (SO) Both Ends Locking Offset Left Without
3 2309413-3 DDR4 SODIMM 260P 9.2H STD Buy Now DDR4 DIMM 9.2 .362 8.2 .322 .254 10 -55 – 85 -67 – 185 .5 .0197 .5 1.2 1.2 High 2 Gold Tape & Reel Black High Temperature Thermoplastic Standard 500 Socket Memory Card UL 94V-0 Printed Circuit Board Board Mount Power Cable-to-Board 260 No Copper Alloy Solder Peg With Gold Flash Cam-In High Temperature Thermoplastic Offset Left Right Angle Surface Mount Both Ends Stainless Steel SO DIMM Nickel 1 Small Outline (SO) Both Ends Locking Offset Left Without
4 2309413-4 DDR4 SODIMM 260P 9.2H STD Buy Now DDR4 DIMM 9.2 .362 8.2 .322 .381 15 -55 – 85 -67 – 185 .5 .0197 .5 1.2 1.2 High 2 Gold Tape & Reel Black High Temperature Thermoplastic Standard 500 Socket Memory Card UL 94V-0 Printed Circuit Board Board Mount Power Cable-to-Board 260 No Copper Alloy Solder Peg With Gold Flash Cam-In High Temperature Thermoplastic Offset Left Right Angle Surface Mount Both Ends Stainless Steel SO DIMM Nickel 1 Small Outline (SO) Both Ends Locking Offset Left Without
5 2309413-5 DDR4 SODIMM 260P 9.2H STD Buy Now DDR4 DIMM 9.2 .362 8.2 .322 .76 30 -55 – 85 -67 – 185 .5 .0197 .5 1.2 1.2 High 2 Gold Tape & Reel Black High Temperature Thermoplastic Standard 500 Socket Memory Card UL 94V-0 Printed Circuit Board Board Mount Power Cable-to-Board 260 No Copper Alloy Solder Peg With Gold Flash Cam-In High Temperature Thermoplastic Offset Left Right Angle Surface Mount Both Ends Stainless Steel SO DIMM Nickel 1 Small Outline (SO) Both Ends Locking Offset Left Without
6 2309414-1 DDR4 SODIMM 260P 9.2H RVS Buy Now DDR4 DIMM 9.2 .362 8.2 .322 -55 – 85 -67 – 185 7.3 .0197 .5 1.2 1.2 High 2 Gold Flash Tape & Reel Black High Temperature Thermoplastic Reverse 500 Socket Memory Card UL 94V-0 Printed Circuit Board Board Mount Power Cable-to-Board 260 No Copper Alloy Solder Peg With Gold Flash Cam-In High Temperature Thermoplastic Offset Right Right Angle Surface Mount Both Ends Stainless Steel SO DIMM Nickel 1 Small Outline (SO) Both Ends Locking Offset Right Without
7 2309414-2 DDR4 SODIMM 260P 9.2H RVS Buy Now DDR4 DIMM 9.2 .362 8.2 .322 .127 5 -55 – 85 -67 – 185 .5 .0197 .5 1.2 1.2 High 2 Gold Tape & Reel Black High Temperature Thermoplastic Reverse 500 Socket Memory Card UL 94V-0 Printed Circuit Board Board Mount Power Cable-to-Board 260 No Copper Alloy Solder Peg With Gold Flash Cam-In High Temperature Thermoplastic Offset Right Right Angle Surface Mount Both Ends Stainless Steel SO DIMM Nickel 1 Small Outline (SO) Both Ends Locking Offset Right Without
8 2309414-3 DDR4 SODIMM 260P 9.2H RVS Buy Now DDR4 DIMM 9.2 .362 8.2 .322 .254 10 -55 – 85 -67 – 185 .5 .0197 .5 1.2 1.2 High 2 Gold Tape & Reel Black High Temperature Thermoplastic Reverse 500 Socket Memory Card UL 94V-0 Printed Circuit Board Board Mount Power Cable-to-Board 260 No Copper Alloy Solder Peg With Gold Flash Cam-In High Temperature Thermoplastic Offset Right Right Angle Surface Mount Both Ends Stainless Steel SO DIMM Nickel 1 Small Outline (SO) Both Ends Locking Offset Right Without
9 2309414-5 DDR4 SODIMM 260P 9.2H RVS Buy Now DDR4 DIMM 9.2 .362 8.2 .322 .76 30 -55 – 85 -67 – 185 .5 .0197 .5 1.2 1.2 High 2 Gold Tape & Reel Black High Temperature Thermoplastic Reverse 500 Socket Memory Card UL 94V-0 Printed Circuit Board Board Mount Power Cable-to-Board 260 No Copper Alloy Solder Peg With Gold Flash Cam-In High Temperature Thermoplastic Offset Right Right Angle Surface Mount Both Ends Stainless Steel SO DIMM Nickel 1 Small Outline (SO) Both Ends Locking Offset Right Without
Part Number
Description
Buy Now
Series
Stack Height [mm]
Stack Height [in]
Row-to-Row Spacing [mm]
Row-to-Row Spacing [in]
Contact Mating Area Plating Thickness [µm]
Contact Mating Area Plating Thickness [µin]
Operating Temperature Range [°C]
Operating Temperature Range [°F]
Centerline (Pitch) [mm]
Centerline (Pitch) [in]
Contact Current Rating (Max) [A]
SGRAM Voltage [V]
DRAM Voltage [V]
Profile
Number of Rows
Contact Mating Area Plating Material
Packaging Method
Housing Color
Housing Material
Keying
???????
Product Type
Socket Type
UL Flammability Rating
Connector & Contact Terminates To
Connector Mounting Type
Circuit Application
Connector System
Number of Positions
Sealable
Contact Base Material
PCB Mount Retention Type
PCB Mount Retention
PCB Contact Termination Area Plating Material
Insertion Style
Latch Material
Module Key Type
Module Orientation
PCB Mounting Style
Retention Post Location
Retention Post Material
Socket Style
Contact Underplating Material
Number of Keys
DRAM Type
Ejector Location
Ejector Type
Center Key
Center Post
Documentation
DDR4 SO DIMM Socket 0.5mm pitch 260 Positions - 2309413-1
DDR4 SO DIMM Socket 0.5mm pitch 260 Positions - 2309413-2
DDR4 SO DIMM Socket 0.5mm pitch 260 Positions - 2309413-3
DDR4 SO DIMM Socket 0.5mm pitch 260 Positions - 2309413-4
DDR4 SO DIMM Socket 0.5mm pitch 260 Positions - 2309413-5
DDR4 SO DIMM Socket 0.5mm pitch 260 Positions - 2309414-1
DDR4 SO DIMM Socket 0.5mm pitch 260 Positions - 2309414-2
DDR4 SO DIMM Socket 0.5mm pitch 260 Positions - 2309414-3
DDR4 SO DIMM Socket 0.5mm pitch 260 Positions - 2309414-5
DDR4 SODIMM 260P 0.50mm Pitch Socket - 2309413-1
DDR4 SODIMM 260P 0.50mm Pitch Socket - 2309413-2
DDR4 SODIMM 260P 0.50mm Pitch Socket - 2309413-3
DDR4 SODIMM 260P 0.50mm Pitch Socket - 2309413-4
DDR4 SODIMM 260P 0.50mm Pitch Socket - 2309413-5
DDR4 SODIMM 260P 0.50mm Pitch Socket - 2309414-1
DDR4 SODIMM 260P 0.50mm Pitch Socket - 2309414-2
DDR4 SODIMM 260P 0.50mm Pitch Socket - 2309414-3
DDR4 SODIMM 260P 0.50mm Pitch Socket - 2309414-5
DDR4 SODIMM SOCKET 0.5mm PITCH 260POS 9.2mm HEIGHT STANDARD TYPE - 2309413-1
DDR4 SODIMM SOCKET 0.5mm PITCH 260POS 9.2mm HEIGHT STANDARD TYPE - 2309413-2
DDR4 SODIMM SOCKET 0.5mm PITCH 260POS 9.2mm HEIGHT STANDARD TYPE - 2309413-3
DDR4 SODIMM SOCKET 0.5mm PITCH 260POS 9.2mm HEIGHT STANDARD TYPE - 2309413-4
DDR4 SODIMM SOCKET 0.5mm PITCH 260POS 9.2mm HEIGHT STANDARD TYPE - 2309413-5
DDR4 SODIMM SOCKET 0.5mm PITCH 260POS 9.2mm HEIGHT REVERSE TYPE - 2309414-1
DDR4 SODIMM SOCKET 0.5mm PITCH 260POS 9.2mm HEIGHT REVERSE TYPE - 2309414-2
DDR4 SODIMM SOCKET 0.5mm PITCH 260POS 9.2mm HEIGHT REVERSE TYPE - 2309414-3
DDR4 SODIMM SOCKET 0.5mm PITCH 260POS 9.2mm HEIGHT REVERSE TYPE - 2309414-5
Qualification Test Report for DDR4 SODIMM SOCKET,8H&9.2H - 2309413-1
Qualification Test Report for DDR4 SODIMM SOCKET,8H&9.2H - 2309413-2
Qualification Test Report for DDR4 SODIMM SOCKET,8H&9.2H - 2309413-3
Qualification Test Report for DDR4 SODIMM SOCKET,8H&9.2H - 2309413-4
Qualification Test Report for DDR4 SODIMM SOCKET,8H&9.2H - 2309413-5
Qualification Test Report for DDR4 SODIMM SOCKET,8H&9.2H - 2309414-1
Qualification Test Report for DDR4 SODIMM SOCKET,8H&9.2H - 2309414-2
Qualification Test Report for DDR4 SODIMM SOCKET,8H&9.2H - 2309414-3
Qualification Test Report for DDR4 SODIMM SOCKET,8H&9.2H - 2309414-5
3D PDF - 2309413-1
3D PDF - 2309413-2
3D PDF - 2309413-3
3D PDF - 2309413-4
3D PDF - 2309413-5
3D PDF - 2309414-1
3D PDF - 2309414-2
3D PDF - 2309414-3
3D PDF - 2309414-5
MD_2309414-1_03262018221_dmtec - 2309414-1
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TE Connectivity High-performing, reliable product solutions that transmit data, power and signal in cars, planes, power grids, appliances, electronics, factories and more.