DIMM Sockets

Manufacturer TE Connectivity
Description Assembly,DDR2VLPDimmSolderTailVertical
Part Number 1888669-1
URL http://www.te.com/usa-en/product-1888669-1.html?te_bu=Cor&te_type=other&te_campaign=trp_glo_buylink-pdp&elqCampaignId=29714
Row-to-Row Spacing [mm] 1.9
Row-to-Row Spacing [in] .075
Contact Mating Area Plating Thickness [µm] .76
Contact Mating Area Plating Thickness [µin] 30
Solder Tail Contact Plating Thickness [µm] 3
Termination Post Length [mm] 2.87
Termination Post Length [in] .113
Operating Temperature Range [°C] -55 – 105
Operating Temperature Range [°F] -67 – 221
Centerline (Pitch) [mm] 1
Centerline (Pitch) [in] .039
Contact Current Rating (Max) [A] .5
Height Above PC Board [mm] 42
Height Above PC Board [in] 1.65
DRAM Voltage [V] 1.8
Center Retention Hole Diameter [mm] 1.8
Center Retention Hole Diameter [in] .07
Packaging Method Box & Tray
Boardlock Material Stainless Steel
Contact Mating Area Plating Material Gold
Housing Color Black
Housing Material High Temperature Thermoplastic
Keying Standard
Mounting Angle Vertical
Number of Rows 2
Packaging Quantity 64
Product Type Socket
Socket Type Memory Card
UL Flammability Rating UL 94V-0
Connector & Contact Terminates To Printed Circuit Board
Connector Mounting Type Board Mount
Circuit Application Signal
Connector System Board-to-Board
Number of Positions 240
Sealable No
Contact Base Material Copper Alloy
PCB Mount Retention Type Boardlock
PCB Mount Retention With
PCB Contact Termination Area Plating Material Matte Tin
Insertion Style Direct Insert
Latch Color Natural
Latch Material High Temperature Thermoplastic
Module Key Type Offset Right
Module Orientation Vertical
PCB Mounting Style Through Hole
Retention Post Location Both Ends
Retention Post Material Stainless Steel
Socket Style DIMM
Contact Underplating Material Nickel
Number of Bays 2
Number of Keys 1
Polarization Left
DRAM Type Double Data Rate (DDR) 2 (Low Profile)
Ejector Location Both Ends
Ejector Material High Temperature Thermoplastic
Ejector Material Color Natural
Ejector Type Locking
Center Key Center
Center Post Without
Product selection
Selector Part Number Description Buy Now Row-to-Row Spacing [mm] Row-to-Row Spacing [in] Contact Mating Area Plating Thickness [µm] Contact Mating Area Plating Thickness [µin] Solder Tail Contact Plating Thickness [µm] Termination Post Length [mm] Termination Post Length [in] Operating Temperature Range [°C] Operating Temperature Range [°F] Centerline (Pitch) [mm] Centerline (Pitch) [in] Contact Current Rating (Max) [A] Height Above PC Board [mm] Height Above PC Board [in] DRAM Voltage [V] Center Retention Hole Diameter [mm] Center Retention Hole Diameter [in] Packaging Method Boardlock Material Contact Mating Area Plating Material Housing Color Housing Material Keying Mounting Angle Number of Rows Packaging Quantity Product Type Socket Type UL Flammability Rating Connector & Contact Terminates To Connector Mounting Type Circuit Application Connector System Number of Positions Sealable Contact Base Material PCB Mount Retention Type PCB Mount Retention PCB Contact Termination Area Plating Material Insertion Style Latch Color Latch Material Module Key Type Module Orientation PCB Mounting Style Retention Post Location Retention Post Material Socket Style Contact Underplating Material Number of Bays Number of Keys Polarization DRAM Type Ejector Location Ejector Material Ejector Material Color Ejector Type Center Key Center Post
1 1888669-1 Assembly,DDR2VLPDimmSolderTailVertical Buy Now 1.9 .075 .76 30 3 2.87 .113 -55 – 105 -67 – 221 1 .039 .5 42 1.65 1.8 1.8 .07 Box & Tray Stainless Steel Gold Black High Temperature Thermoplastic Standard Vertical 2 64 Socket Memory Card UL 94V-0 Printed Circuit Board Board Mount Signal Board-to-Board 240 No Copper Alloy Boardlock With Matte Tin Direct Insert Natural High Temperature Thermoplastic Offset Right Vertical Through Hole Both Ends Stainless Steel DIMM Nickel 2 1 Left Double Data Rate (DDR) 2 (Low Profile) Both Ends High Temperature Thermoplastic Natural Locking Center Without
2 1888669-5 AssmDDR2VLPDimmSolderTailVertical Buy Now 1.9 .075 .38 15 3 3.38 .133 -55 – 105 -67 – 221 1 .039 .5 42 1.65 1.8 1.8 .07 Box & Tray Stainless Steel Gold Black High Temperature Thermoplastic Standard Vertical 2 64 Socket Memory Card UL 94V-0 Printed Circuit Board Board Mount Signal Board-to-Board 240 No Copper Alloy Boardlock With Matte Tin Direct Insert Natural High Temperature Thermoplastic Offset Right Vertical Through Hole Both Ends Stainless Steel DIMM Nickel 2 1 Left Double Data Rate (DDR) 2 (Low Profile) Both Ends High Temperature Thermoplastic Natural Locking Center Without
Part Number
Description
Buy Now
Row-to-Row Spacing [mm]
Row-to-Row Spacing [in]
Contact Mating Area Plating Thickness [µm]
Contact Mating Area Plating Thickness [µin]
Solder Tail Contact Plating Thickness [µm]
Termination Post Length [mm]
Termination Post Length [in]
Operating Temperature Range [°C]
Operating Temperature Range [°F]
Centerline (Pitch) [mm]
Centerline (Pitch) [in]
Contact Current Rating (Max) [A]
Height Above PC Board [mm]
Height Above PC Board [in]
DRAM Voltage [V]
Center Retention Hole Diameter [mm]
Center Retention Hole Diameter [in]
Packaging Method
Boardlock Material
Contact Mating Area Plating Material
Housing Color
Housing Material
Keying
Mounting Angle
Number of Rows
Packaging Quantity
Product Type
Socket Type
UL Flammability Rating
Connector & Contact Terminates To
Connector Mounting Type
Circuit Application
Connector System
Number of Positions
Sealable
Contact Base Material
PCB Mount Retention Type
PCB Mount Retention
PCB Contact Termination Area Plating Material
Insertion Style
Latch Color
Latch Material
Module Key Type
Module Orientation
PCB Mounting Style
Retention Post Location
Retention Post Material
Socket Style
Contact Underplating Material
Number of Bays
Number of Keys
Polarization
DRAM Type
Ejector Location
Ejector Material
Ejector Material Color
Ejector Type
Center Key
Center Post
Documentation
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TE Connectivity High-performing, reliable product solutions that transmit data, power and signal in cars, planes, power grids, appliances, electronics, factories and more.