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ICK BGA 31 x 31 x 10, for IC design BGA and others, 31 x 31 x 10 mm (B x L x H)

Heatsinks for BGA

Manufacturer Fischer Elektronik GmbH & Co. KG
Description Heatsinks for BGA
Reference ICK BGA 31 x 31 x 10
Product selection
Selector Reference Desingation way of fixation socket suitable for processor type thermal resistance_K/W dissipation loss P_W surface
1 ICK BGA 31 x 31 x 10 Heatsink for IC design BGA and others, 31 x 31 x 10 mm (B x L x H) therm. conductive foil, therm. cond. adhesive universal universal 17 - 5 3,7 black anodised
Reference
Desingation
way of fixation
socket
suitable for processor type
thermal resistance_K/W
dissipation loss P_W
surface
Documentation
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Fischer Elektronik GmbH & Co. KG kühlen schützen verbinden
Fischer Elektronik GmbH & Co. KG