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ICK BGA 27 x 27 x 14, for IC design BGA and others, 27 x 27 x 14 mm (B x L x H)

Heatsinks for BGA

Manufacturer Fischer Elektronik GmbH & Co. KG
Description Heatsinks for BGA
Reference ICK BGA 27 x 27 x 14
Product selection
Selector Reference Desingation way of fixation socket suitable for processor type thermal resistance_K/W dissipation loss P_W surface
1 ICK BGA 27 x 27 x 14 Heatsink for IC design BGA and others, 27 x 27 x 14 mm (B x L x H) therm. conductive foil, therm. cond. adhesive universal universal 13,5 - 4 9,5 black anodised
Reference
Desingation
way of fixation
socket
suitable for processor type
thermal resistance_K/W
dissipation loss P_W
surface
Documentation
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Fischer Elektronik GmbH & Co. KG kühlen schützen verbinden
Fischer Elektronik GmbH & Co. KG