With ceramic multilayer decoupling capacitor 100 nF +80% -20% / 50 V, epoxy encapsulated.
preci-dip
Closed frame standard low profile DIL Sockets.
For mechanical and electrical interconnection, PCB stacking or elevated positioning of display modules.
DIL Sockets with compliant press-fit pin for solderless mount in PCB plated through holes.
Open frame standard low profile DIL Sockets. Sockets with increased solder tail length of 4.2 mm
Sockets with soft brass pin series
Specially designed for reflow soldering including vapor phase with unique self-aligning floating contacts.
Solderless wire-wrap terminals are firmly fitted in the insulator body to withstand torque of wrapping tool.
Open frame standard low profile DIL Sockets.
Specially designed for reflow soldering including vapor phase with gull wing terminations for maximum strength and easy in-circuit test.
Right angle DIL Sockets for components to be mounted perpendicularly to the PCB such as displays.
“Ultralow” sockets have specially designed contacts for reduced socket height above PCB.
